NASA is Working on Technology to 3D Print Circuits in Space - by et_exists
, who each coordinated their efforts with Dr. Samuels and Paquette, demonstrating the collaborative effort undertaken for the project.
Image of the engineering team from NASA and the University of Maryland’s Laboratory for Physical Sciences : Team lead and Goddard aerospace engineer, Beth Paquette; Wallops electronics engineer Brian Banks; Jason Fleischer of LPS; and Donghun Park, also with LPS. They are displaying the curved metal plate with their printed electronics test assembly in a NASA Wallops Flight Facility laboratory prior to the SubTEC-9 technology test flight from Wallops in April 2023.
The circuits were both designed and printed by LPS engineer, Jason Fleischer, who said the SubTEC-9 mission establishes a “turning point” for the evolution and validation of printed-circuit technology at LPS. Image of a 3D-printed circuit on display during the Goddard Field Day event that launched on the Suborbital Technology Experiment Carrier-9 technology test flight from NASA’s Wallops Flight Facility in April 2023. tested a total of 14 different types of technologies
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