Bosch, Infineon, NXP, TSMC to establish JV for German wafer fab

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Bosch, Infineon, NXP, TSMC to establish JV for German wafer fab
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German technology group Robert Bosch (ROBG.UL) announced plans to establish a joint venture with TSMC, Infineon, and NXP to build a wafer fab in Dresden, Germany. The joint venture, with TSMC owning 70% and Bosch, Infineon, and NXP each holding a 10% stake, aims to start operations by the second half of next year. The total investments for the project are expected to exceed 10 billion euros ($10 billion).

The joint venture will be 70% owned by TSMC, with Bosch, Infineon and NXP each holding a 10% equity stake, according to a statement, and total investments are expected to exceed 10 billion euros via equity injection, debt borrowing, and strong support from the European Union and German government.

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