Analyst Matt Kimball offers his take on AMD's newly announced 2nd Generation EPYC offering, codenamed 'Rome.'
Share to facebookIn case you weren’t convinced by AMD’s re-entry to the server market with the initial launch of EPYC in 2017, the company today launched an what I consider an incredible follow-on product with EPYC 7002 Series . While the market was excited to see the company re-enter the market with the original EPYC CPU, there was still a little bit of a “wait and see” attitude. A couple years and about 5% market share points later, “wait and see” has turned into “hurry up and buy.
By the way, what is a hybrid multi-die design, or, as we call it, “chiplets?” Basically, it is a design process intended to increase the compute density within a given physical footprint, by creating chip modules that connect on a separate die that contains I/O and memory controllers. With EPYC, AMD connected the chip modules via a high-speed interconnect, named Infinity Fabric.
encrypts and isolates virtual machines, providing protection of VMs against attacks, other exploited virtual machines, and even from rogue administrators. IT organizations that are a little more forward-thinking can realize even greater savings by deploying single-socket servers based on EPYC. These servers can deliver VM density and performance levels that exceed most of two-socket servers populating the datacenter today. For that matter, socket-based licensing costs are cut in half. Why more IT organizations aren’t exploring this option is baffling, given the significance of software licensing on IT budgets.
If AMD is wise in its go-to-market approach, Rome will mark the expansion of AMD’s addressable market in the datacenter. Based on conversations I’ve had with IT executives, the trepidation of deploying EPYC in enterprise datacenter and downstream should be gone. Enthusiasm is high. The market is ready for AMD.
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